国家/地区 中国（4） 台湾（3） 世界知识产权组织（3） 日本（2） 韩国（2）
IPC部 C（4）
IPC大类 C09（4）
IPC小类 C09J（4）
IPC C09J011/04（4）
发明人 ICHIKAWA I（2） ISAO I（2） TAKEO Y（2）
YOSHINOBU T（2）
公开年 2022（4）
申请年 2021（4） 
专利权人 LINTEC CORP（2）

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Thermally conductive gasket comprises composite heat conducting layer including heat conducting double-faced adhesive tape and a graphite sheet, and porous cross-linked net structure can form interfacial adhesion under atmospheric pressure.

YANG J, HU S, GU B