国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08L（7） C08K（6） C08J（5）
C09D（4） F16L（4） B05D（3）
C09K（3） B29D（2） B32B（2）
F24D（2） F28F（2）
IPC C08L023/06（7）
发明人 LIU J（2） WANG J（2）
公开年 2021（3）
申请年 2020（3） 
专利权人 ANHUI GLANT .（2）

Modified polyethylene wearable composite pipe for water supply and drainage of municipal and building, has glass fiber line that is provided with multiple layers on outer layer pipe structure, inner tube body and outer layer pipe body fixedly connected with the inner layer pipe body.

LIN J

Corrosion resistant polyethylene water supply pipe material comprises base layer and anticorrosive graphene coating comprising polyethylene, color master batch, epoxy resin and dispersant.

LIU J, WANG J, LI H

High heat-conducting graphene floor heating pipe comprises pipe body, polyethylene layer, steel wire net layer, and graphene heat-conducting layer including graphite, antioxidant, dispersant, coupling agent, heat stabilizer, and plasticizer.

XU W, LIU Y, ZHANG H

Reinforced wear-resistant polyethylene water supply pipe useful for trenchless construction, comprises pipe body including a pressure-resistant layer and compatible layer and compatibility layer arranged inside the pressure-resistant layer.

LIU J, TIAN X, LIU P, JIN R, ZHOU W, ZHANG W

Base material used for core carrier, is obtained by mixing graphene-coated metal material with modifier chosen from polyethylene, polyvinylidene fluoride, and polyurethane, and wetting film to obtain porous thermal conductive film material.

QIN L, LIANG P, ZHI L, ZHAN Z, CHI S, WANG L, ZHU H

Oxygen-barrier floor heating pipe comprises an inner layer (of modified graphene oxide, fluoropolymer and polymer matrix), an outer layer (of e.g. polymer matrix), an adhesive layer (of e.g. hot melt adhesive) and an oxygen-barrier layer.

WANG J, GAO Y, XIE W

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J