国家/地区 韩国（6）
IPC部 C（6）
IPC大类 C22（6）
IPC小类 C22C（6） B22F（4） C23C（4）
B23Q（2） C25D（2） H01L（2）
H02N（2）
IPC B22F003/24（3） B22F009/04（2） B23Q003/15（2）
C22C001/10（2） C22C038/10（2） C23C004/11（2）
C23C004/134（2） H01L021/683（2） H01L021/687（2）
H02N013/00（2）
发明人 HANSANG K（2） KWON H（2） LEE J（2）
公开年 2022（4） 2023（2）
申请年 2022（6）
专利权人 UNIV PUKYONG.（2）

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

High-strength steel plate comprises base steel plate, and ferrite layer having internal oxide layer on which iron-nickel alloy layer is formed with excellent surface quality formed in internal oxide layer from surface of ferrite layer.

LEE K, LEE C, KANG K, KIM N, JANG Y, LEE J, KANG K C, KIMNAMAH, JANG Y M

Metal-graphene composite comprises metal layer and graphene layer provided by growing directly on one surface of metal layer, where graphene layer contains two and/or more graphene thin, metal layer is copper, nickel, cobalt, iron, manganese, chromium, vanadium, titanium, platinum, gold and aluminum.

KIM D J, HONG B H, WOO Y S, KIM D, YU Y S

Manufacturing electrostatic chuck having high heat dissipation property, high resistance to thermal shock and lightness, involves preparing composite powder by ball-milling aluminum or aluminum alloy powder and carbon-based nanomaterial powder, preparing electrode layer and forming dielectric layer.

KWON H, HANSANG K

Manufacturing electrostatic chuck having high heat dissipation property, involves preparing composite powder by ball-milling aluminum or aluminum alloy powder and carbon-based material powder, manufacturing multilayer billet, extruding and forming dielectric layer.

KWON H, HANSANG K

Manufacture of metal-carbon composite material used in transport device, involves pulverizing nanocarbon material, adding metal powder to nanocarbon pulverized product, pulverizing mixed powder, sintering composite powder, and heat-treating sintered material.

CHOI H J, SON H S, NAM S J, JUNG C H, HAN J Y, HANSOL S, JIN N, JEONG C