国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C09K（3） C23C（3）
IPC C09K005/14（3）
发明人
公开年 2021（3）
申请年 2021（2） 
专利权人

Copper/graphene composite film material prepared by adding single-layer graphene dispersion to basic electroless copper plating solution by using ultrasonic-assisted electroless plating method to co-deposit metallic copper and single-layer graphene on surface of substrate.

SHU X, CUI J, WANG Y, QIN Y, TAO X, ZHOU Z, WU Y, ZUO Y, ZHANG Y

Preparing atomic layer deposition auxiliary preparation used for carbon composite material, which is used in field of energy storage or heat conduction, involves depositing metal oxide layer on carbon material by atomic layer deposition.

WAN G, WANG G, XU X, ZHOU M

Thermal interface material used in interface connection method to connect electronic devices, comprises intermediate layer and framework structure comprising metal or alloy framework structure of micro-nano size.

LIU L, REN H, JIANG Y, WANG W, ZOU G