国家/地区 中国（3）
IPC部 C（3）
IPC大类 C23（3）
IPC小类 C23C（3） C25D（3）
IPC C25D005/54（3）
发明人
公开年 2022（2）
申请年 2021（3）
专利权人

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Preparation of ultrathin beta-radiation source for micro-components, involves using polymethyl methacrylate/graphene film and platinum sheet, and depositing beta-radiation source on graphene using solution of e.g. beta-radiation source.

ZHANG J, LI C, WANG X, XU P, FENG H, CHEN Z, YANG Y, WU W, ZHOU C, LUO T

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q