国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D003/38（3）
发明人 CHEN Y（3）
公开年
申请年
专利权人 UNIV CHINA E.（2）

Peeling layer useful for preparing ultra-thin copper foil, comprises barrier layer on carrier copper foil, conductive layer on barrier layer, and crystalline layer on the conductive layer, and the ultra-thin copper foil is formed on crystalline layer.

CHE S, XIANG C, GAO Y, SU X, HE W, WANG S, CHEN Y, ZHOU G, HONG Y, LIU X, WANG C

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E

Through-hole plating method for printed circuit boards, involves grafting graphene oxide with gamma-aminoethylaminopropyltrimethoxysilane to give product, adsorbing product of active metal ions, and electroplating.

CHEN Y, WANG Y, LI Q, HE W, WANG C, WANG S, ZHOU G, WANG Q, AI K, HU Z