国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D003/12（2） C25D005/18（2）
发明人 HU Z（3）
公开年 2020（3）
申请年 2020（2） 
专利权人 JIANGSU ENN .（2） JIANGSU JIAN.（2）

Performing electrodeposition preparation process of nickel-coated graphene composite powder, comprises taking the graphene and dispersant in a mass ratio, mixing, mechanical grinding to surface functionalization.

HU Z, TANG G, LI D, LIU T, XU H, LI J

Graphene-modified high-strength nickel-based complex material comprises nickel(II) sulfate, nickel(II) chloride, boric acid, sodium dodecyl benzene sulfonate, saccharin, graphene dispersion liquid, and deionized water.

LI D, TANG G, HU Z, LIU T, XU H, LI J

Through-hole plating method for printed circuit boards, involves grafting graphene oxide with gamma-aminoethylaminopropyltrimethoxysilane to give product, adsorbing product of active metal ions, and electroplating.

CHEN Y, WANG Y, LI Q, HE W, WANG C, WANG S, ZHOU G, WANG Q, AI K, HU Z