国家/地区 美国（7） 世界知识产权组织（4） 中国（3） 欧洲专利局（EPO）（2） 台湾（2）
IPC部 C（8）
IPC大类 C01（8）
IPC小类 C01B（8） F28F（7） H01L（5）
B82Y（4） C09K（3） F28D（3）
H05K（3） C08J（2） C09D（2）
IPC C01B031/04（8）
发明人
公开年 2013（2） 2014（2） 2016（2）
申请年 2013（3）  2015（2）  2016（2） 
专利权人

Spacecraft structure i.e. satellite, has exhaust source points whose portion is directed such that outflow from exhaust source points partially impacts functional component, and graphene coating comprising set of graphene flakes.

KHAYMS V, SINTON S W, BEDWORTH P V

Drying device for graphene or graphite oxide, comprises heater, storage tank, feeding pump, heat exchanger, drying tower, cyclone collector, air filter, draft fan and waste gas discharge pipe, where air filter is connected with heater.

CHEN C, KONG Q, WANG D, LI S, DAN J, XIE L, WANG W, SU X

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

Composite material used for thermal-conducting material for thermal management of collagen, comprises metal matrix and graphene platelets dispersed in the metal matrix with random orientation.

KIM N P

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K

Thermal management device e.g. heater or heater component comprises a composition comprising graphene sheets.

BROOKS L, SCHEFFER D

Dispersion of carbon nanotubes or graphene using external energy source for mixing, utilizing hemicellulose that contains e.g. glucose and xylose in backbone as dispersion agent, used to fabricate e.g. electromagnetic interference shield.

KANGAS V, MOILANEN P, VIRTANEN J

Graphene-based heat dissipation system for e.g. portable microelectronic device, has heat-conducting layer comprising sheet of integrated graphene film, which shields component or external surface of electronic device from heat.

ZHAMU A, WANG M, XIONG W, JANG B Z