国家/地区 中国（64）
IPC部 C（64） H（64） B（20）
F（6） D（5） A（2）
IPC大类 C09（64）
IPC小类 C09K（64） H01B（27） H01L（27）
C08K（22） C01B（20） C08L（20）
H05K（18） H01M（15） C08J（13）
B82Y（10） B01J（7） C09D（6）
F28F（6） C04B（5） C23C（5）
IPC C09K005/14（64）
发明人 LI Z（4） JANG B Z（3） LI Q（3）
LIU H（3） MA C（3） YANG Y（3）
ZHANG J（3） ZHANG X（3） CHEN M（2）
CHENG H（2） GE X（2） HE C（2）
LEE M（2） LI J（2） LI W（2）
公开年 2022（19） 2021（12） 2015（7） 2014（5） 2023（5） 2017（4） 2018（4） 2020（3） 2016（2）
申请年 2022（15）  2020（10）  2021（10）  2014（7）  2013（4）  2015（4）  2016（4）  2018（3）  2019（3）  2011（2） 
专利权人 NANOTEK INST.（3） FUJI POLYMER.（2） INST METAL R.（2） JIANGSU JIAN.（2）
UNIV GUANGDO.（2） UNIV SHANGHA.（2） UNIV SICHUAN（2） UNIV TSINGHU.（2）

Composite thermally and electrically conductive material based on carbon fiber molding of active screen plasma nitridation processing technology comprises modified carbon fiber e.g. carbon fiber filament, toughening agent, heat conducting powder, plasticizer, antioxidant and compatibilizer.

XU J, GUO F

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Preparing graphene-based thermally conductive/conductive composite material, comprises e.g. pressing open-cell metal foam laminate, annealing pressed foam metal, catalyzing graphene on the surface of the metal foam substrate, removing the metal substrate, and post-processing.

CHENG H, LIU H, MA C, REN W

Preparing heat intelligent material by mixing agglomerant, heat conducting material, thermal expansion material and solvent, freezing first mixture, impregnating second mixture, curing and obtaining heat intelligent material.

WANG J, YANG Y

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Heat-conducting wave-absorbing material with electromagnetic shielding function has a two-layer structure, the upper layer is a heat-conducting wave-absorbing gel layer, and the lower layer is an aluminum foil layer.

ZHANG X, YANG Y, FAN J, ZHANG C, MA C, WANG Z

Preparing directional heat conductive graphite carbon film and directional heat conduction carbon part comprises dissolving soluble polyimide and graphene oxide in dimethylacetamide solvent, stirring, placing film on rolling roller, folding, pressing film, evaporating solvent and continuing pressing.

GUO H

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Preparing copper/ graphene composite material for e.g. power transmission comprises carrying out one-time hydrothermal method, adding copper salt and reducing agent into beaker , transferring solution into constant temperature water bath, performing suction filtration, washing, and vacuum drying.

MA J, DU W, PANG J, ZHANG L

Preparing high-performance composite material, comprises performing surface treatment to graphene material, adding nano metal particles into cetyltrimethylammonium bromide solution for surface treatment, and ultrasonically dispersing.

CHEN R, FANG Q, ZHU Z, MAI Y, ZENG S, ZHANG K