国家/地区 中国（3） 韩国（3）
IPC部 B（7） C（7） E（2）
IPC大类 B05（7） C09（7） C04（3）
C08（3） E04（2）
IPC小类 B05D（7）
IPC C09D007/63（7）
发明人 HAN K T（2）
公开年 2022（7）
申请年 2021（7）
专利权人

Composition useful in paint for preventing corrosion and enhancing durability of structures, comprises powder mixture consisting of zinc, phosphorus and balance of aluminum and adhesive resin in which powder mixture is uniformly dispersed.

HAN K T

Paint composition used for film adhesion method, comprises powder mixture comprising zinc, phosphorus, graphene oxide and aluminum, and adhesive resin comprising (diethylamino)phenyl diazinyl-thieno thiazolyl (hexyloxy)phenyl prop-2-enenitrile compound.

HAN K T

Coating composition used for bonding film, comprises powder mixture comprising zinc, phosphorus, aluminum and graphene oxide, and adhesive resin containing 2-((1E)-(2-(2,3-dihydro-1,3-benzothiazol-2-yl)hydrazin-1-ylidene)methyl)-4-(((2E)-3-phenylprop-2-enoyl)oxy)phenyl compound.

HAN S H

Coating composition for use in exterior sheathing panel of a building, comprises acrylic latex, glycol ether and humectant, acrylic latex is acrylic polymer, glycol ether e.g. monomethyl ether of dipropylene glycol, propylene glycol n-butyl ether and/or ethylene glycol phenyl ether.

HERNANDEZ P, AVERILL M

Modified and toughened coating raw material liquid for polymer composite explosion-proof door panels comprises toughening modifier, modification auxiliary agent, surfactant, polyester coating, and solvent.

LIU X, SUN M, GU X

Antistatic coating material useful for preparing antistatic coating, comprises chelates of polymer molecule and metal ion, and conductive nanomaterial, polymer molecule contains amino groups; chelates of polymer molecule and metal ion, and conductive nanomaterial form mixed solution.

QIN F, LIU Y, ZHOU Y

Anti-corrosion for metal down-conductor of graphite-based grounding grid, by performing excavation which exposes metal down conductor, removing surface dust and corrosion, applying silicone rubber coating, covering with polyethylene isolation film, and leading down-conducting wire for soil filling.

ZHANG G, WANG X, ZHU J, DU J, ZHAO Y, GENG J, ZHANG Y, YAO D, KOU X, LI Y, TANG L, XIE W, MA Y, DONG M