国家/地区 中国（4）
IPC部 B（4） C（4）
IPC大类 B22（4）
IPC小类 B22D（4）
IPC C22C032/00（4）
发明人 LI Q（2）
公开年 2021（3）
申请年 2021（4）
专利权人

Metal-based composite material for use in heat sink of electronic device, has reinforcement particles comprising silicon carbide particles, diamond particles, boron carbide particles or graphene particles dispersed in metal matrix, where metal matrix has single metal matrix or alloy matrix.

WANG L, LI Q, ZHAO J

Light alloy product used in aerospace, computer, communication and consumer electronics, and automobile manufacturing applications, is prepared by melting, mixing, and injection molding solid magnesium alloy raw materials and modified materials through complete machine.

SU X, CUI T, LI Q, LIU Y, GU L, ZHANG H, ZENG X, DENG J

Graphene-reinforced rare earth magnesium-based composite material comprises specified amount of graphene, silver and rare-earth magnesium alloy substrate.

JI S, LUO Z, HOU X, WANG S, XIAO L, DIAO W, SUN J, ZHOU H, WANG Y

Processing tinned copper-clad alloy wire involves preparing alloy rod, welding copper and alloy wire to form copper-clad alloy wire blank, carrying out multiple times of small deformation drawing processing, and plating tin layer.

OUYANG Y