国家/地区 中国（4）
IPC部 B（4） C（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC B32B009/00（4）
发明人
公开年 2021（3）
申请年 2021（4）
专利权人

Composite structure heat conducting plate for use in electronic chip industry, has m metal layers and n graphite layers, where m metal layers and n graphite layers are alternately arranged and assembled by vacuum diffusion bonding process.

HU T, NIU T, GUO S, CHEN X

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Long-life guide cylinder comprises e.g. outer layer as pre-oxidized felt insulating felt, middle layer as modified resin formed on inner side wall of outer layer, and inner layer as carbon/carbon composite material formed on inner side wall of middle layer.

BAI Y, QIN X, LIU Y, ZHOU J

Flame-retardant and environmentally friendly plastic includes PC plastic base layer, first cubic boron nitride flame-retardant layer arranged on upper surface of PC plastic base layer.

LI Z, ZHOU B, SHEN T