国家/地区 中国（4）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC B32B017/02（4）
发明人 CHEN K（2） YU D（2）
公开年 2022（4）
申请年 2021（4）
专利权人 ITEQ WUXI EL.（2）

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

Preparing anti-deformation acrylic sheet with thermal insulation function comprises e.g. preparing acrylic base layer, preparing fiber layer, preparing thermal insulation coating, coating the thermal insulation layer coating on the fiber layer, and drying.

ZHANG X, LIN X, JIA L, WANG J, ZHU X

Continuous fiber bundle reinforced composite material that is used for preparing photovoltaic module backplane material, automobile shell, battery shell, rail transit equipment shell, aircraft portion, comprises strip material layer, and upper film layer and lower film layer.

WU X, CHEN H, CHENG X, HAN X, TANG K, CUI B, HU Q, WANG L, YAN S