国家/地区 中国（4）
IPC部 B（4）
IPC大类 B32（4） C08（4） H05（2）
IPC小类 B32B（4）
IPC C08J005/24（4）
发明人 LI Y（2）
公开年 2021（4）
申请年 2020（4）
专利权人

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Heat-resistant epoxy resin composition for preparing halogen-free intermediate-glass-transition-temperature copper-clad plate, contains graphene-modified epoxy resin, graphene-modified phenolic epoxy resin, and tetrafunctional epoxy resin.

LI Y, LIN Y, CHEN W, WEN J

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M