国家/地区 欧洲专利局（EPO）（8）
IPC部 B（8）
IPC大类 B32（8） C08（8） C09（5）
B29（2） H01（2） H05（2）
IPC小类 B32B（8）
IPC C08K003/04（8）
发明人 KIM Y S（2）
公开年 2021（8）
申请年 2019（3）  2021（3）  2020（2） 
专利权人

Forming graphene-infused fiber composite which is used as air frame materials for aircraft, comprises providing graphene consisting of graphene particles in solvent to form mixture and applying mixture to surface of fiber composite layer.

KOZIOL K

Composition used for forming e.g. pipe, comprises resin and graphene material.

LADISLAUS P, ARMSTRONG N

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Pharmaceutical packaging sheet useful in pharmaceutical packaging material, comprises base layer, adhesive layer formed on base layer, aluminum layer formed on adhesive layer, and resin layer, where all layer includes graphene.

HEO C H, PARK Y S, KANG T W, HEO J H, SOON P Y, KANGTAEWOON, HEO C, PARK Y, KANG T

Aqueous adhesive for manufacture of laminated cellulosic board, comprises water, starch, polymer, glue enhancer, and stabilizing agents, gelling agents, thickener, antifoaming agents, tackifier and/or damp-proofing resins.

ZURUTUZA ELORZA A, ORTEGA MURGUIALDAY A, ALONSO RODRIGUEZ B, ZURUTUZA E A, ORTEGA M A, ALONSO R B, ZURUTUSA E A, ORTEGAMURGIALDEI A, ELORZA A Z, MURGUIALDAY A O, RODRIGUEZ B A

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E