国家/地区 中国（4） 美国（4） 欧洲专利局（EPO）（3） 世界知识产权组织（3） 日本（2）
IPC部 B（6） F（6） H（4）
C（2）
IPC大类 B32（6） F28（6） H01（4）
H05（2）
IPC小类 B32B（6）
IPC F28F021/02（6）
发明人
公开年 2014（2） 2016（2）
申请年 2014（3） 
专利权人

Fluid radiating small volume graphene-aluminum composite dividing wall type heat exchanger, has fixed shell whose inner wall is uniformly distributed with layers of composite heat exchange plates, where support strips are uniformly distributed between adjacent composite heat exchange plates.

FANG R, HU T

Graphene layer high heat-conducting radiator, has aging-resistant heat-conducting rubber layer directly fixed on outside of adhesive layer, and graphene heat-conducting interlayer directly fixed on outer surface of heat conduction pieces.

LIN R

Composite structure comprises organic resin, carbon fiber and flat graphene nanosheets embedded in resin.

LUTZ M, TANZILLI D, BURGER N, LAACHACHI A

Graphene-based thermal management core for printed wiring boards (PWB) used for electronics applications, e.g., consumer electronics, has first or second reinforcement layer which includes substrate impregnated with non-dielectric resin.

SCHNEIDER D, DAVIS W E

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Thermal management assembly for transferring heat away from heat source, comprises first substrate, second substrate, bulk graphene material disposed between first and second substrates, and thermal bond layer.

FAN W, LIU X, MARINER J, RAPE A