国家/地区 中国（4）
IPC部 B（4）
IPC大类 B32（4） H05（4）
IPC小类 B32B（4）
IPC B32B003/08（4）
发明人 CAO Y（4）
公开年 2021（2） 2022（2）
申请年 2021（4）
专利权人 SHENZHEN HFC.（3） SHENZHEN HFC.（2）

Three-dimensional heat-conducting wave-absorbing reinforced composite film for use in electronic product, has through hole fixed with diamond particles coated with graphene, where diamond particles include diamond particles and graphene film.

FANG X, HE X, ZHOU X, DOU L, YANG S, SUN A, CAO Y

Graphene-liquid metal heat conducting gasket useful in thermal interface material, has graphene film provided with multiple through-holes passing through the upper and lower surfaces, through-holes are filled with liquid metal, and liquid metal is filled in the gap of the inner structure.

FANG X, HE X, ZHOU X, DOU L, YANG S, SUN A, CAO Y

Graphene heat-conducting gasket wrapping process involves coating layer of colloid around graphene heat conducting gasket, and forming wrapping layer after curing colloid.

ZHOU X, DOU L, HE X, YANG S, SUN A, CAO Y

Graphene heat-conducting gasket, comprises multi-layer graphene film, whose adjacent layers are coated with adhesive, graphene film provided with multiple through holes passing through upper and through hole is provided with carbon fiber.

ZHOU X, DOU L, HE X, YANG S, SUN A, CAO Y