国家/地区 中国（5）
IPC部 B（5）
IPC大类 B32（5） C08（5）
IPC小类 B32B（5）
IPC C08K007/14（5）
发明人 WANG L（3）
公开年 2022（4）
申请年 2021（5）
专利权人

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Continuous fiber bundle reinforced composite material that is used for preparing photovoltaic module backplane material, automobile shell, battery shell, rail transit equipment shell, aircraft portion, comprises strip material layer, and upper film layer and lower film layer.

WU X, CHEN H, CHENG X, HAN X, TANG K, CUI B, HU Q, WANG L, YAN S

Multifunctional oxygen barrier pipe useful in cold water and/or hot water conveying and preparing floor heating pipe material, comprises first PB layer, outer hot melt adhesive layer, aluminium layer, inner hot melt adhesive layer and second PB layers from outside to inside in turn.

JIN J, WANG L, LIANG Y

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Cast polypropylene film useful for aluminum plastic film, comprises first layer including e.g. toughening agent and adhesion promoter, second layer including copolymerized polypropylene, and third layer including e.g. adhesion promoter.

XIAO Z