国家/地区 中国（8） 巴西（6） 韩国（4） 日本（3） 世界知识产权组织（3）
IPC部 B（25）
IPC大类 B32（25） C08（15） C09（8）
H05（5） C01（4） C04（4）
D06（3） F41（3） B82（2）
G12（2） H01（2）
IPC小类 B32B（25）
IPC C08K003/04（8） B32B027/06（6） B32B005/02（5）
B32B009/00（5） B32B027/34（5） B32B033/00（5）
B32B027/12（4） B32B027/18（4） B32B027/20（4）
B32B005/26（3） B32B009/04（3） B32B027/08（3）
B32B027/32（3） B32B027/38（3） C01B032/182（3）
发明人 NEVES MONTEIRO S（4） COSTA U O（2） LI J（2）
MONTEIRO S N（2） PEREIRA A C（2） XU Y（2）
公开年 2022（25）
申请年 2020（25）
专利权人 PEREIRA A C（4） NEVES M S（3） CAMPOSO PERE.（2） COSTA U O（2）
MONTEIRO S N（2）

Preparing heat-pressing molding foam absorbing material involves mixing raw materials comprising components, foam type surfactant, wave absorbing agent, catalyst and water to form to-be aggregate raw material, where wave absorbing agent is carbon black, graphite, carbon nano tubes and graphene.

YANG R, ZHAO Z, LIU R

Shell body assembly, comprises shell body, temperature change layer and aqueous ink layer set on the inner surface, temperature change layer set between shell body and aqueous ink layer, and aqueous ink layer set between temperature change layer and shell body.

ZHAO R

Composite material used for multilayer armor system, comprises thermosetting polymer reinforced with natural fiber.

NEVES MONTEIRO S, CAMPOSO PEREIRA A

Preparing black master batch for thin film soft package useful for thin film soft package used for lithium-ion pouch cell, comprises using double-screw extruder under special screw thread and component screw combination condition.

CHEN X, LI Z, JIA L, LIN X, LIAO G

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Composite material e.g. composite plate for preparing ceramic material and multilayer armor, comprises thermosetting polymer reinforced with natural fibers.

NEVES MONTEIRO S

Heat dissipation sheet for heat sink member useful in electronic devices comprises aluminum foil, thermoelectric graphene layer, polyethylene terephthalate film layer and film liner.

YUN C

Composite material used for forming multilayer armor and multilayer ballistic system, comprises thermosetting polymer reinforced with natural fabric.

NEVES MONTEIRO S

Composite material used for manufacturing ceramic material, multilayer armor, personal vest, military vehicle, or layer of multilayer ballistic system, comprises natural fiber-reinforced thermoset polymer.

NEVES MONTEIRO S

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D