国家/地区 台湾（2） 美国（2） 世界知识产权组织（2）
IPC部 B（6）
IPC大类 B32（6）
IPC小类 B32B（6）
IPC B32B009/00（4） C23C016/26（3） B32B037/00（2）
B82Y040/00（2） H01B005/14（2） H01B013/00（2）
发明人
公开年 2021（4） 2022（2）
申请年 2021（6）
专利权人

Laminate used for electronic device such as display device, comprises substrate, layer containing compound having condensed polycyclic hydrocarbon structure, and layer containing conductive material.

NAOYA N, KAZUNORI T, NOSAKA N, TAKANASHI K

Adhesion promoting layer for depositing conductive layer on inorganic or organic-inorganic hybrid substrate to form conductive structure, includes metal oxide layer containing metal oxide and chelating agent, arranged on inorganic or organic-inorganic hybrid substrate, and interface layer.

HUANG M, WANG W, CHANG Y

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Heat transferable biodegradable substrate used for manufacturing moldable interconnect devices (MIDs), comprises first layer comprising poly lactic acid (PLA) matrix dispersed with graphene oxide (GO) particles and second layer.

WINOWLIN J J T, ABHISHEK S, AMEENUDEEN Z, ADAM K M

Transferring graphene involves forming graphene on first substrate, forming polymer precursor mixture on second substrate, providing graphene oppositely to second substrate having polymer precursor mixture.

GU T J, JANG W, SEO Y, WHANG D, WHANG D M, SEO Y M, JANG W S

Preparing flexible temperature sensor based on graphene nanowall for e.g. optoelectronic devices, by preparing graphene nanowall on metal or substrates, transferring graphene nanowall with polymer, and connecting ends of nanowall and silver.

PENG X, WANG S, ZHENG Q