国家/地区 中国（5）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC B32B009/00（4） B32B009/04（4） B32B015/20（3）
C23C016/26（3） B32B033/00（2） B32B037/06（2）
B32B037/10（2） C23C014/18（2）
发明人
公开年 2021（3） 2022（2）
申请年 2021（5）
专利权人

Composite structure heat conducting plate for use in electronic chip industry, has m metal layers and n graphite layers, where m metal layers and n graphite layers are alternately arranged and assembled by vacuum diffusion bonding process.

HU T, NIU T, GUO S, CHEN X

Composite material used for improving electroconductivity of metal, has graphene fragment layer that comprises graphene fragments uniformly spread on metal foil layer.

GONG M, SUN B, WANG Y, CHEN Q, YANG W, LI Y, LIANG J, LIU B, ZHANG X, PEI Z

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Long-life guide cylinder comprises e.g. outer layer as pre-oxidized felt insulating felt, middle layer as modified resin formed on inner side wall of outer layer, and inner layer as carbon/carbon composite material formed on inner side wall of middle layer.

BAI Y, QIN X, LIU Y, ZHOU J

Flame-retardant and environmentally friendly plastic includes PC plastic base layer, first cubic boron nitride flame-retardant layer arranged on upper surface of PC plastic base layer.

LI Z, ZHOU B, SHEN T