国家/地区 台湾（7）
IPC部 B（7）
IPC大类 B32（7） C01（6） B82（5）
H01（4） C23（3）
IPC小类 B32B（7）
IPC C01B031/02（5） B82Y030/00（4） C01B031/04（4）
B32B009/00（3） B32B037/00（3） B82Y040/00（3）
C23C016/26（3） B32B009/04（2） B32B038/10（2）
H01B013/00（2）
发明人 FAN F Y（4） FAN S（4） JIANG K（4）
LIN X（4） XIAO L（4） LIN X Y（3）
公开年 2012（7）
申请年 2011（7）
专利权人 HON HAI PREC.（4） HONGFUJIN PR.（4） UNIV TSINGHU.（4）

Method of transferring a graphene film involves carrier to expose the first graphene film and removing the patterned carrier to transfer the first graphene film on the substrate.

TZENG Y, CHEN W, TZENG Y H

Making graphene/carbon nanotube composite structure, comprises forming a graphene film on a substrate, and forming a substrate/graphene/carbon nanotube composite structure by combining a carbon nanotube layer with the graphene film.

JIANG K, LIN X, XIAO L, FAN S, LIN X Y, FAN F Y

Making graphene/carbon nanotube composite structure, comprises growing graphene film on surface of metal substrate by chemical vapor deposition method, cooling metal substrate, and providing carbon nanotube film structure on graphene film.

JIANG K, LIN X, XIAO L, FAN S, LIN X Y, FAN F Y

Making thermoacoustic element involves arranging graphene film on metal substrate/forming laminate structure by stacking nonmetal substrate on substrate/removing substrate from laminate structure/forming through-holes in nonmetal substrate.

JIANG K, LIN X, XIAO L, FAN S, IM H Y, FAN F Y

Graphene/carbon nanotube composite structure comprises carbon nanotube film structure having carbon nanotubes or nanotube wires and micropores; and graphene film located on a surface of film structure, and covering all of the micropores.

JIANG K, LIN X, XIAO L, FAN S, LIN X Y, FAN F Y

Transfer method of graphene film for manufacture of transparent conductive film for e.g. display, involves bonding substrate and layer(s) of graphene film formed on another substrate using adhesive resin layer containing volatile substance.

KIMURA N, SHIMIZU K, FUKUDA T

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J