国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3） C09（3） F28（2）
H01（2）
IPC小类 B32B（3）
IPC C09K005/14（3）
发明人
公开年 2014（3）
申请年 2014（2） 
专利权人

Silicon glue heat conducting structure has silicon resin layer that is connected with adhesive layer, and graphene conducting film that is directly connected with heat cover and silicon resin layer.

WU F

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K