国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3） F28（3） H01（3）
C09（2） H05（2）
IPC小类 B32B（3）
IPC F28F021/02（3）
发明人
公开年 2014（3）
申请年 2013（2） 
专利权人

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K

Thermal management assembly for transferring heat away from heat source, comprises first substrate, second substrate, bulk graphene material disposed between first and second substrates, and thermal bond layer.

FAN W, LIU X, MARINER J, RAPE A