国家/地区 德国（5）
IPC部 B（5）
IPC大类 B32（5） H05（4） H01（3）
C01（2）
IPC小类 B32B（5）
IPC B32B009/00（3） H05K003/46（3） B32B007/12（2）
B32B015/04（2） B32B037/12（2） C01B032/182（2）
发明人 ATIAS B（3） LEVI A（3） MENTOVICH E（3）
NAVEH D（3） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） LIPP E（2） ROTEM Y（2）
公开年 2022（4）
申请年 2022（5）
专利权人 MELLANOX TEC.（3） UNIV BARILAN（3） PCB TECHNOLO.（2）

Electronic component package, comprises polymeric core comprising first polymeric material and an outer overmold layer comprising second polymeric material containing graphene, outer overmold layer defining a case skin disposed on polymeric core,where first and second polymeric are thermoplastic.

NARITA M, SARANG S, KHAN S

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Method of depositing two-dimensional material onto target substrate, involves removing starting substrate layer from laminate stack after heat and pressure is applied to form target two-dimensional structure.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A

Electrical steel used as strip e.g. steel sheets, comprises functional layer comprising ferromagnetic material and additional layer comprising non-magnetizable material, which are connected by adhesive bond with atomic diffusion.

FRANKEN C, PLATT J