国家/地区 美国（3） 欧洲专利局（EPO）（2） 韩国（2） 世界知识产权组织（2）
IPC部 B（3）
IPC大类 B82（3）
IPC小类 B82B（3）
IPC C08K003/04（3）
发明人
公开年 2012（2）
申请年 2012（3）
专利权人

Making high-strength composite comprises e.g. plating conducting surface on substrate, electroplating flat graphene flakes onto surface from carrier fluid suspension of graphene flakes, removing plated substrate from vessel and drying.

BULLINGTON J A, STOLTZ R A, BULLINGTON J, STOLTZ R

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Graphene-polyurethane nanocomposite for applications such as conductive adhesive and composites for electrostatic and electromagnetic dissipation, comprises graphene, where graphene and polyurethane self-align into layers.

XIAO A Y, CAO J, LIU Y, KIM J K, ZHENG Q, ABOUTALEBI S H, GUDARZI M M, KIM J, ABOUTALEBI S, GUDARZI M, XIAO A