国家/地区 世界知识产权组织（5） 中国（4） 日本（4） 美国（3） 欧洲专利局（EPO）（2）
IPC部 B（6）
IPC大类 B32（6）
IPC小类 B32B（6）
IPC B32B015/04（6）
发明人
公开年 2021（2）
申请年
专利权人 MITSUBISHI M.（2）

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Graphene bonded body having structure comprises graphene-containing carbonaceous member containing graphene aggregate and member to be joined, junction interface, active metal compound layer formed on member, and tin-concentrated layer.

TOYO O, OHASHI T

Graphene heat sink comprises a heat dissipation layer and a substrate, where the substrate is provided with a first surface having two-dimensional or three-dimensional structure.

BAI D

Formation of graphene scroll for synthesizing graphene article, involves annealing catalyst substrate in hydrogen gas, exposing substrate to reaction gas mixture, detaching substrate from graphene and consolidating synthesized graphene.

VLASSIOUK I V, IVANOV I N, DATSKOS P G

Forming graphene layer used in e.g. transistors, solar panels, involves mixing carbon source with molten solvent, precipitating carbon source from solvent to form graphite layer, and separating graphite layer into several graphene layers.

SUNG C, HU S C, LIN I, YU C, SONG J

Composite material for manufacture of heat-emitting component, comprises layers of fibrous carbon material including tubular structural component composed of graphene, and base material including discharge plasma sintered compact.

KATAGIRI K, SHIMIZU A, IMANISHI T, SATO T, NAKAMA N, KAKITSUJI A, SASAKI K, AKIYUKI S, ASSEUSI G, DERUMICHYU I, DOYOHIRO S, GAJEUAKI G, GASSEUHIKO S, NOBUHITO N, ATSUSHI K, KATSUHIKO S, KAZUAKI K, TERUMITSU I, TOYOHIRO S