国家/地区 韩国（2）
IPC部 C（3）
IPC大类 C01（3） C09（3） C08（2）
IPC小类 C01B（3）
IPC C01B032/198（3）
发明人
公开年 2022（3）
申请年 2022（2） 
专利权人

Preparing thermally conductive resin used in electronic packaging, comprises e.g. uniformly mixing epoxy resin and 4-methylhexahydrophthalic anhydride, adding 2-ethyl-4-methylimidazole, continuing to uniformly mix to obtain epoxy resin mixture, and vacuumizing.

ZHU D

Manufacture of packaging film for e.g. detergent, involves applying non-solvent two-component adhesive composition to base film on which printed layer is formed, drying, laminating base film, aging and processing film into desired shape.

JEONG H R, LEE D H

Photothermal adhesive composition for fabrication of a microfluidic chip, comprises graphene-transition metal compound composite.

CHOI H W, LEE J M, KIM Y J, LIM J H, CHUNG B G, JEA K Y, LEE J