国家/地区 中国（4）
IPC部 C（4）
IPC大类 C01（4）
IPC小类 C01B（4）
IPC C01B021/064（4）
发明人 WANG H（4）
公开年 2021（2）
申请年 2021（2） 
专利权人

Graphene/copper/micron particle composite material useful in e.g. graphene high-temperature heating ink for high-temperature heating bodies for electronic cigarette lighters, kettles, bakeware, heaters and electric ceramic stove, comprises micron particles, copper element and graphene.

LI N, WANG H, SONG Q, JIANG B

Transferring two-dimensional materials involves bonding the side of the growth substrate with the two-dimensional material and support layer through adhesive layer to obtain layered structure, removing growth substrate in etching solution.

LIU J, WANG H, XU Z, JIANG X

Preparing boron nitride nanostructure-graphene composite material, by adding nano boron powder, chelating agent and cobalt salt to deionization, stirring, filtering, and vacuum drying, heating in ammonia atmosphere and cooling.

WANG H, XU M, JI J, ZHU L, WANG S, SHEN F, DAI W, CHEN C

Method for preparing graphene-boron nitride hetero-junction, involves heating and removing heat release adhesive tape to obtain graphene-boron nitride hetero-junction.

CHEN J, LU G, WU T, ZHANG X, WANG H