国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C01（4）
IPC小类 C01B（4）
IPC C08L063/00（4）
发明人
公开年
申请年 2012（2） 
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat-dissipation composite is obtained by bonding carbon nanotubes with longitudinal direction of growth on nano-graphene plate, attaching carbon hybrid filler with carbon nanotubes, and mixing polymer resin with carbon hybrid filler.

HAN J H, LEE C S, PARK J S, SHIN K W, YU L

Making high-strength composite comprises e.g. plating conducting surface on substrate, electroplating flat graphene flakes onto surface from carrier fluid suspension of graphene flakes, removing plated substrate from vessel and drying.

BULLINGTON J A, STOLTZ R A, BULLINGTON J, STOLTZ R

Conductive material e.g. transparent conductive electrode for touchscreen or LCD display, comprises assemblage of graphene sheets interconnecting electrically in discrete transparent layer, which has area of greater than specified value.

HAMILTON J, STREICH P, HAEMILTEON J, SEUTEURECHI P, STREICH P V, HAMILTON J P