国家/地区 中国（6）
IPC部 C（6）
IPC大类 C01（6）
IPC小类 C01B（6）
IPC C01B031/04（3） F21Y115/10（3） C01B032/194（2）
C08K003/04（2） F21V029/85（2）
发明人
公开年 2017（2） 2022（2）
申请年 2021（2） 
专利权人

Use of graphene film as high temperature resistant thermal interface material or heat dissipation film material.

CHENG H, LIU H, MA C, REN W

Preparation of aluminum alloy composite heat dissipation material containing carbide/graphene sandwich structure for LED lamp, involves adding nickel nitrate nonahydrate into ethanol, and adding prepared nitrate ethanol solution to resin.

WANG Z, XU J, HUANG J

Heat-conducting column used in heat-dissipation structure of light-emitting diode lamp, comprises water-absorbing layer coated with carbon fiber layer which is coated with graphene layer.

CHEN D, JI H

Graphene-containing coating film used for head lamp, comprises hydrates, graphene positioned on surface of hydrates, and silica particles including agglomerates of silica nanoparticles, positioned on surface of hydrate and graphene.

LEE K G, CHANG K I, HUR S H, LI K, ZHANG G, HSU S

Structure useful to shield electromagnetic disorders for shielding electromagnetic radiation, comprises thin layer of graphene and flexible substrate, in which thin layer of graphene is applied on flexible substrate and is doped with dopant.

AVOURIS P, GARCIA A V, SUNG C, XIA F, YAN H

Heat-radiating interface material used for large-power LED lamp package, comprises silicone resin component as substrate, dimethyl silicone oil, and functional graphene micro sheet as heat-conducting filler.

LI C, ZHANG H