国家/地区 台湾（3）
IPC部 C（3）
IPC大类 C01（3） H05（2）
IPC小类 C01B（3）
IPC C01B032/20（3）
发明人 HE M（2） HUANG C（2） HUANG H（2）
公开年 2022（3）
申请年 2021（3） 
专利权人 CTRON ADVANC.（2）

Heat dissipation structure for electronic device e.g. mobile phone, has heat dissipation module whose side protrudes from top surface of heat generating element, and does not contact with surface of carrier.

HE M, HUANG H, HUANG C

Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.

HE M, HUANG H, HUANG C

Composite material for electromagnetic wave shielding or electromagnetic wave absorption, comprises electromagnetic wave absorbing materials containing two-dimensional graphene sheets, which is obtained by crushing carbon raw material through cavitation principle in liquid phase exfoliation method.

XIE Y, HE X, LIU W, HO H, HSIEH I