国家/地区 中国（4）
IPC部 C（4）
IPC大类 C04（4）
IPC小类 C04B（4）
IPC C04B026/14（4）
发明人
公开年 2020（2）
申请年
专利权人

Graphene paste used for coating heat dissipation structure of electronic device, comprises ceramic powder, graphene prepared by pressing expandable graphite and microwave puffing, metal powder, epoxy resin powder, activator and dispersant.

TAO Y, CHEN L, JIANG W, SHU G, GUO H, YANG Y

Graphene-modified resin packaging material, comprises bisphenol A epoxy resin, toughening agent, graphene resin dispersion, and silicon powder as first component; and curing agent, accelerator, and toughening agent as second component.

YANG X, ZENG Y, WANG G, WANG J, LU N, LU K

Graphene far infrared heating carpet comprises blanket layer, bottom layer connected under the carpet layer by edge stitching, zipper provided on one side of cover, and core layer provided in the cover and carpet layer.

DAI M

Graphene heat sink comprises a heat dissipation layer and a substrate, where the substrate is provided with a first surface having two-dimensional or three-dimensional structure.

BAI D