国家/地区 日本（4）
IPC部 B（4）
IPC大类 B23（4）
IPC小类 C04B（4）
IPC B23K020/00（2） C04B035/645（2） C04B037/02（2）
发明人 NOBUYUKI T（2） TERASAKI N（2）
公开年 2021（4）
申请年 2020（3） 
专利权人 MITSUBISHI M.（2）

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N

Ceramic/copper/graphene assembly used as heat radiating member, has structure in which ceramic member, copper member and graphene-containing carbonaceous member are joined, active metal carbide layer, and magnesium solid solution layer.

NOBUYUKI T, TERASAKI N

Heating material surface involves exposing surface to electromagnetic radiation source emitting first wavelength spectrum not greater than 10 percent overlap, and receiving second wavelength spectrum from surface by detector.

MATSON C, DAWSON J, FARANDOS N, DAWSON M

Semiconductor manufacturing equipment component, comprises a plate-like aluminum nitride sintered body having a placement surface on which a substrate is to be placed, an electrode is embedded in the aluminum nitride sintered body.

OOKI K, OKI K