国家/地区 韩国（3）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08G059/50（4）
发明人
公开年 2023（4）
申请年 2021（4）
专利权人

Manufacturing composite material comprises e.g. preparing foam structure using composite resin containing hexanediol diacrylate and graphene, preparing composite by filling structure with mixture and curing composite.

HOUN K J, CHOI H J

Amine composition used in epoxy system for producing structural or electrical laminates, coatings, castings, structural components, circuit boards, electrical varnishes, encapsulants, and semiconductors, comprises alkylated diamine, tertiary amine and polyoxyalkyleneamine.

PENG Q, LI S

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Manufacturing carbon fiber reinforced epoxy composites reinforced with graphene oxide/graphite nanofiber composite comprises impregnating graphene oxide/graphite nanofiber composite, epoxy resin and curing agent into carbon fibers.

PARK S, HWANG K S, KIM Y