国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3） C09（2）
IPC小类 C08G（3）
IPC C08G073/10（3）
发明人 CHEN C（2） WANG D（2） YANG L（2）
ZHAO J（2） ZHAO X（2） ZHOU H（2）
公开年 2023（3）
申请年 2023（3）
专利权人 UNIV JILIN（2）

Shape memory polyimide aerogel used in heat insulation, comprises polyimide precursor which is prepared by polycondensation reaction using diamine and dianhydride monomers, followed by sol-gelation, freeze-drying and thermal-imidization.

ZHANG W, LI J, ZHANG L

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D