国家/地区 韩国（5） 中国（3）
IPC部 C（8） H（3）
IPC大类 C08（8） H05（2）
IPC小类 C08G（8）
IPC C08K003/04（8）
发明人
公开年 2023（8）
申请年 2021（8）
专利权人

Composition useful in e.g. article, preferably flexible display device of electromagnetic wave shielding film and for transportation devices comprises graphene oxide, nano cellulose, reducing agent comprising hydroxy and amino group.

HONG S W, BAE S, HONG P H, LEE Y, HANUI K, CHOI K W, NO A

Manufacturing composite material comprises e.g. preparing foam structure using composite resin containing hexanediol diacrylate and graphene, preparing composite by filling structure with mixture and curing composite.

HOUN K J, CHOI H J

Polylactic acid composite material with shape memory performance used in tissue engineering and medical and health applications such as artificial muscles, artificial joints and surgical sutures, comprises polylactic acid, polycaprolactone, modified graphene oxide and compatibilizer.

LI H, WANG Y, LONG Y, XING Q

Environmentally-friendly buoys composition useful for fixing the nets installed to display location of objects and to farm fish, shellfish comprises highly crystalline polypropylene and reduced graphene, dispersant and antioxidant.

KIM H S, LEE G J

Graphene Polyether Ketone Ketone composite material useful in preparing conductive electric device and preparing electrode of electromagnetic device comprises terephthaloyl chloride, diphenyl ether, N-N dimethylformamide, polar aprotic solvent and boron trifluoride.

YU C, WEI S, PEI X, WANG Q, LIU H, JIA D

Producing liquid crystalline graphene oxide polyamate composite film, comprises coating the liquid crystal solution containing graphene oxide and polyamic acid in liquid crystal phase, on a substrate, arranging and drying.

YOU N H, RYU J S, YUN L S, JIN J

High-strength polyurethane rigid foam material is prepared from raw materials containing white material first component and polyisocyanate second component, where first component includes polyether polyol, modified filler, foam stabilizer, composite catalyst, flame retardant and foaming agent.

MIAO B, ZHANG W, GAO B, LI Y, SONG K, PANG D, HAN H

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K