国家/地区 台湾（5）
IPC部 C（5） H（4）
IPC大类 C08（5） C09（4） H01（3）
H05（2）
IPC小类 C08G（5）
IPC C08K003/08（5）
发明人
公开年 2021（2） 2022（2）
申请年 2021（2） 
专利权人 SHINETSU CHE.（2）

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Bio-electrode composition used in contact with skin of living body for detecting physical conditions such as heart rate, comprises (A) reaction composite comprising ionic polymer material and carbon particle.

HATAKEYAMA J, SHANRUN

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Electroconductive composition used as interconnection material to connect solar cells into photovoltaic module, comprises silicone resin, silicone crosslinker, electroconductive particles, solvent, adhesion promoter, catalyst, and inhibitor.

HENCKENS A, THEUNISSEN E, YANG J, ZHANG Y, CHEN Y

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q