国家/地区 中国（11）
IPC部 C（11）
IPC大类 C08（11） C09（5）
IPC小类 C08G（11）
IPC C08K003/36（11）
发明人 WEN Y（6） WANG X（4） CHENG X（3）
WANG L（3）
公开年 2018（6） 2016（3） 2017（2）
申请年 2016（11）
专利权人 HENAN HAINAD.（6）

Flame retardant material comprises e.g. polyether polyol, toluene diisocyanate, nanometer white carbon black, deionized water, dimethyl methyl phosphonate, graphene oxide, barium titanate and nano-zinc oxide.

WANG X, WEN Y, WANG L

Composite absorbent porous material comprises e.g. polyether polyol, toluene diisocyanate, nano carbon solution, nano white carbon black, deionized water, dimethyl methyl phosphonate, graphene oxide and barium titanate.

WANG X, WEN Y, WANG L

Polyurethane ferrite complex wave absorbing porous material comprises polyether polyol toluene diisocyanate nanocarbon sol nano white carbon black deionized water dimethyl methyl phosphate graphene oxide ferrite and silicon carbide.

WANG X, CHENG X, WEN Y

Polyurethane-ferrite composite wave-absorbing flame retardant material comprises e.g. polyether polyol, toluene diisocyanate, nano white carbon black, de-ionized water, dichlophos methyl, graphene oxide, ferrite and silicon carbide.

WANG X, CHENG X, WEN Y

Composite flame retardant material contains polyether polyol, toluene diisocyanate, nano-silica, deionized water, dimethyl phosphate, graphene oxide, ferrite, zirconia, zinc borate, stannous octoate and sodium bicarbonate.

CHENG X, ZHANG M, WEN Y

Polyurethane absorbing porous material contains polyether polyol, toluene diisocyanate, nano-carbon sol, nano-silica, deionized water, dimethyl methylphosphonate, graphene oxide, iron oxide, zinc borate and stannous octoate.

WANG L, WEN Y

Polyurethane nano flame resistant composite material comprises polyether polyol reaction type flame retardant, graphene oxide grafted polyaniline, and catalyst and second component.

HAN Y, WANG S, LI T, WANG T, GAO X, ZHANG Z

Modified graphene oxide used in preparing graphene/silicon dioxide hybrid polyimide foam, is modified graphene oxide containing isocyanate on surface.

QI K

Photo-curable resin material used in three-dimensional printing, comprises epoxy acrylic resin, active diluent, photoinitiator, additive, graphene and multi-walled carbon nanotubes, in specified weight ratio.

LI S

Heat resistant high strength polyimide film comprises e.g. sulfur-containing diamine, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, and graphene.

WEI S