国家/地区 中国（5）
IPC部 B（6）
IPC大类 C08（6） B32（4） B29（2）
IPC小类 C08G（6）
IPC C08K007/14（6）
发明人
公开年 2022（6）
申请年 2022（4） 
专利权人

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

High hardness polyurethane tire useful in forklift tire for fork wheel, comprises curing agent comprising dispersion of complex of small molecular diamine and sodium chloride in dioctyl adipate and isocyanate prepolymer composed of diisocyanate and polyether polyol.

WANG J, LI F

Preparing heat-pressing molding foam absorbing material involves mixing raw materials comprising components, foam type surfactant, wave absorbing agent, catalyst and water to form to-be aggregate raw material, where wave absorbing agent is carbon black, graphite, carbon nano tubes and graphene.

YANG R, ZHAO Z, LIU R

Composite material used for forming structural material, comprises closed cell polyurethane matrix portion exhibiting properties associated with wood, and particulate portion homogeneously distributed and suspended in matrix portion, where particulate portion is fiberglass and hemp fiber.

CHRISTY J, ESCOBAR H