国家/地区 中国（24） 欧洲专利局（EPO）（2） 美国（2） 世界知识产权组织（2）
IPC部 C（28） B（3） G（2）
H（2）
IPC大类 C08（28）
IPC小类 C08G（28）
IPC C08G073/10（28）
发明人 LIU G（4） XU Z（4） ZHANG Q（3）
CHEN J（2） JIN W（2） ZHANG Y（2）
ZHENG Y（2） ZHOU Z（2）
公开年 2021（17） 2022（10）
申请年 2021（28）
专利权人 ZHEJIANG ZHO.（5）

Producing liquid crystalline graphene oxide polyamate composite film, comprises coating the liquid crystal solution containing graphene oxide and polyamic acid in liquid crystal phase, on a substrate, arranging and drying.

YOU N H, RYU J S, YUN L S, JIN J

Polymer composition used in semi-conductors, consumer electronics and industrial constructions, comprises polyetherimide resin, crystalline polyester resin, inherently dissipative polymer, and transesterification inhibitor.

JIANG X, ZHENG Y, CHENG Y

Preparing graphene-polyimide composite resin useful as macromolecular resin, comprises performing polymerizing reaction of graphene powder, dianhydride and diamine in non-polar solvent to obtain prepolymer suspension, suction-filtering, drying and hot press molding.

ZHOU Z, SHAN Y, ZHANG Y, CHEN B, SUN X, DING H

Preparing multi-level structure graphene/polyimide composite sponge useful in e.g. adsorption of pollutant, organic solvent and dyes, comprises e.g. dispersing graphene in deionized water, adding polyethylene glycol, adding silicon dioxide, adding silane coupling agent, and adding diphenyl ether.

HUANG K, QIN J, ZHANG Z, YU P, BAO L

Preparation of polyimide film for high-frequency communication electronic equipments, involves polymerizing aminated graphene quantum dot powder, diamine monomer and dicarboxylic anhydride monomer, adding pore-foaming agent, casting, stretching, performing thermal imidization treatment.

SUN S, PAN C, FANG C, SU J

Graphene-polyimide (PI) film useful in electronic field comprises 4,4'-Oxydiphthalic anhydride, 4,4'-diaminodiphenyl ether, modifier, filler and binder.

SHI L, ZHU Q, ZHENG Z

Preparation method of graphene polyimide high temperature resistant flame retardant fiber for welding gloves, mixing bis(4-aminophenoxy)phenylphosphine oxide and modifier, graphene oxide solution, 4,4-diaminodiphenyl ether, pyromellitic dianhydride, 3,3,4,4-biphthalic dianhydride.

MA L, SHA X, SHA Y

Polyimide material used for aerospace comprises phosphorus containing polyimide resin, silicon containing anti atomic oxygen filler and conductive filler.

ZHI X, LV F, LIU J, ZHANG Y

Polyimide composition comprises polyimide, where polyimide is polymeric reaction product of dianhydride and one or more diamines, where diamines comprises fluorine-containing alkyl ether diamine, and thermally conductive fillers.

CONNELL J W, BELCHER M A, GHOSE S

Preparing high heat-conducting polyimide film useful in flexible heater comprises e.g. pouring graphene oxide into mixed solution of aromatic diamine, biphenyl dianhydride and dimethylacetamide solution to obtain polyamic acid solution, heating polyamic acid solid film, and forming film.

LI L, CHEN J, TANG X, XU Y