国家/地区 中国（8） 韩国（2）
IPC部 C（9）
IPC大类 C08（9）
IPC小类 C08G（9）
IPC C09J011/04（9）
发明人 LIU Y（2） WU X（2）
公开年 2023（9）
申请年 2022（6）  2023（2） 
专利权人

High-barrier heat-resistant solvent-free polyurethane composite material useful as film lamination in packaging composite field of e.g. daily chemical, comprises e.g. polyurethane prepolymer, graphene modified polyol, polyester polyol, nano-silicon dioxide modified polyether polyol and isocyanate.

HE C, TIAN L, WEN Y

Carbon dioxide-based bi-component polyurethane thermal-conducting adhesive comprises isocyanate terminated double ended polyurethane prepolymer, spherical alumina as thermally conductive filler, polyether polyol, polybutadiene polyol and small molecule polyol.

CAO Y, LIU T, LIN H, ZHANG X

Cyclic silicon-hydrogen bond-containing crosslinking agent useful in preparing adhesive sealant composition for inductors, comprises gamma-methacryloxypropyltrimethoxysilane, tetramethylcyclotetrasiloxane, graphene oxide, first platinum catalyst and methylbutynol.

WU Z, CAI X, LI F, WU X, ZHOU Q

Single-component thermally conductive hot-melt polyurethane adhesive useful in electronic products comprises polyester polyol, polyether polyol, heat-conducting medium, flame-retardant medium, isocyanate and additive.

CHEN Z

Preparing high-reliability epoxy resin absorbing adhesive film with controllable fluidity by mixing epoxy resin matrix and toughener to compound epoxy resin system, placing epoxy resin system, absorbent, and inorganic filler into resin internal mixer for banbury rough mixing and fine mixing.

GONG Y, LIU J, LI M, LI Y, LV T

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J

Preparing environmentally-friendly aqueous adhesive useful in manufacturing containers, comprises e.g. reacting silicon carbide nano-wire with 3-amino propyl trimethoxy silane and graphene to obtain modified silicon carbide nanowire and reacting with polyurethane emulsion and methyl methacrylate.

LIU Y, QU L

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Adhesive useful for organic light-emitting diode protective film for e.g. intelligent mobile phone, comprises polyester polyol, diisocyanate, chain extender, heat-resistant monomer, antistatic agent, solvent, catalyst, and blocked isocyanates.

LIU Y, HUANG Y, NIU Z, AN J, LIU C, ZHOU S