国家/地区 美国（6）
IPC部 C（6） H（3）
IPC大类 C08（6）
IPC小类 C08G（6）
IPC C08J005/18（6）
发明人
公开年 2021（2）
申请年 2020（2）  2021（2） 
专利权人

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Preparing high-frequency transmission liquid crystal polymer film useful for e.g. electronics, comprises acetating monomers, crushing high-temperature polymerization of acetylated monomer and phenolic resin, mixing liquid crystal copolyester, cooling, slitting longitudinally and transversely.

XU L, YU R, ZHANG D

Polyurethane composition used in polyurethane elastomer, comprises polyisocyanate component comprising isocyanate-terminated prepolymer obtained from reaction of polyol with 1,4-bis(isocyanatomethyl cyclohexane), or mixture of 1,4-bis(isocyanatomethyl cyclohexane), and isocyanate-reactive component.

SONG N

New modified graphene used for forming modified graphene-resin composite and modified graphene dispersion, has preset ratio of intensity of G band with respect to intensity of D band in Raman spectroscopy spectrum.

WATANABE T, KITAO A, SUZUKI K, KOBAYASHI Y, WATANABE D, KOBAYASHI A

Preparing glue composition involves adding graphene powder and polymer monomer, where mixture is added with solvent.

CHEN Y, LI Y, ZHANG X, LEE Y