国家/地区 日本（5）
IPC部 C（5）
IPC大类 C08（5） H01（3）
IPC小类 C08G（5）
IPC C08K003/04（4） C08L063/00（2） C08L101/00（2）
发明人
公开年 2012（5）
申请年 2011（2）  2012（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Resin composite material is obtained by chemically bonding reactive polyfunctional compound to both of thermoplastic resin, and carbon material having graphene structure.

MUKOHATA D, INUI N, TAKAHASHI K, OSANO K, MUKAIHATA D

Conductive polymer material used in solar cell, organic electroluminescent device, lithium ion battery and super capacitor, comprises conductive polymer and fluorinated graphene.

ZHOU M, ZHONG L, WANG Y

Polymer composition, useful to make molded articles and extruded articles (rods, tubes, sheets or films), comprises poly(arylether ketone), and non-tubular graphene material (nano-graphene platelets).

KWAN K S, ELHIBRI M J, MILTNER H E, KWAN K, ELHIBRI M, MILTNER H, HIBEURI M J E

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J