国家/地区 中国（6）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08L079/08（7）
发明人
公开年 2022（7）
申请年 2021（7）
专利权人

Polymer composition used in semi-conductors, consumer electronics and industrial constructions, comprises polyetherimide resin, crystalline polyester resin, inherently dissipative polymer, and transesterification inhibitor.

JIANG X, ZHENG Y, CHENG Y

Preparing multi-level structure graphene/polyimide composite sponge useful in e.g. adsorption of pollutant, organic solvent and dyes, comprises e.g. dispersing graphene in deionized water, adding polyethylene glycol, adding silicon dioxide, adding silane coupling agent, and adding diphenyl ether.

HUANG K, QIN J, ZHANG Z, YU P, BAO L

Preparation of polyimide film for high-frequency communication electronic equipments, involves polymerizing aminated graphene quantum dot powder, diamine monomer and dicarboxylic anhydride monomer, adding pore-foaming agent, casting, stretching, performing thermal imidization treatment.

SUN S, PAN C, FANG C, SU J

Graphene-polyimide (PI) film useful in electronic field comprises 4,4'-Oxydiphthalic anhydride, 4,4'-diaminodiphenyl ether, modifier, filler and binder.

SHI L, ZHU Q, ZHENG Z

Polyimide material used for aerospace comprises phosphorus containing polyimide resin, silicon containing anti atomic oxygen filler and conductive filler.

ZHI X, LV F, LIU J, ZHANG Y

Preparing high heat-conducting polyimide film useful in flexible heater comprises e.g. pouring graphene oxide into mixed solution of aromatic diamine, biphenyl dianhydride and dimethylacetamide solution to obtain polyamic acid solution, heating polyamic acid solid film, and forming film.

LI L, CHEN J, TANG X, XU Y

Polyimide antistatic film comprises polyimide and antistatic agent, polyimide antistatic film prepared by adding polyimide and antistatic agent into organic solvent, dissolving, mixing uniformly, coating, forming film, removing solvent.

JIN W, LIU G, HU T