国家/地区 台湾（5）
IPC部 B（5） C（5） H（4）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC C08K003/04（3）
发明人
公开年 2021（2）
申请年 2021（2） 
专利权人

Condensation curable composition used as article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises condensation curable organopolysiloxane, silicone-imide crosslinker, condensation cure catalyst and additive.

DEY K, MILLER C, KONWAR D B, RAJENDRA V, FUJIMOTO T, MANDAL S

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Two-dimensional, graphene-based porous polymer used for e.g. porous carbon for manufacture of e.g. supercapacitor, comprises graphene layer which is sandwiched between porous polymer which is microporous, by covalent bond.

VENKATARAMAN S S, FENG X, ZHUANG X, ZHANG F, WU D

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J