国家/地区 中国（3） 韩国（2） 世界知识产权组织（2）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08K009/12（5）
发明人 LEE E J（2） LEE K（2） LEE K D（2）
LIU Y（2） NAM C R（2） SEO M K（2）
SONG J（2） SONG J H（2）
公开年 2022（3） 2023（2）
申请年 2022（5）
专利权人 HANSOL CHEM .（2）

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Thermally conductive wave absorbing silicone rubber composite material for use in the field of electronic communication, comprises vinyl silicone oil, hydrogenated silicone oil, graphene aerogel, ferrite powder, metal supported inorganic thermally conductive powders, platinum catalyst and inhibitors.

JIANG X, LIU W, GUO J

Silicone protective cover for a mobile storage hard disk, is prepared by kneading and molding vinyl silicone oil, hydrogen-containing silicone oil, silicone resin, inhibitor, catalyst, and thermally conductive filler containing modified polyurethane fiber, and N-phenylamino-cage polysilsesquioxane.

ZHANG J, LIU Y

Preparing thermally conductive filler for highly thermally conductive elastomer comprises e.g. adding composite thermally conductive material and grafted graphene oxide to mixed solvent of ethanol and water, ultrasonically dispersing, grinding, transferring to reaction vessel, and precipitating.

LIU Y, ZHONG R, LI T