国家/地区 中国（3）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08K003/04（4）
发明人 WANG C（4）
公开年 2021（3）
申请年 2020（2） 
专利权人 CHANGCHUN AP.（2）

Carbon-based composite filler used for high heat-conducting electromagnetic shielding composite material, comprises inner surface and outer surface of carbon-based filler combined with molecules of resin by interface modifier chemical bond.

WANG H, BAO D, ZHU Y, WANG J, LIU Z, WANG C

Electromagnetic shielding composite material used in 5G communication or aerospace application, comprises absorbing layer comprising modified resin layer and reflective layer having metal nanowire film layer compounded on absorbing layer.

RAN X, WANG C, FU C, NIE W, QIAN J, GAO Y, CHU H

Electromagnetic shielding composite material used in 5G communication or aerospace, comprises absorbing layer and reflecting layer compounded on absorbing layer.

RAN X, WANG C, FU C, NIE W, QIAN J, GAO Y, CHU H

Insulated thermal interface material for applying between electronic element e.g. central processing unit, and thermal dissipating element, comprises base including polymer, and filler including graphene dispersed in base.

LING Y, WANG C, LIU J, LING Y C, WANG C P, LIU J Y