国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08L063/02（4）
发明人
公开年 2021（4）
申请年 2021（3） 
专利权人

Preparation method of wave-absorbing epoxy resin of wave-absorbing epoxy resin composite material, involves banburying and coarse mixing epoxy resin and absorbent, refining, mixing, adding curing agent, triggering and curing wave-absorbing epoxy resin curing system at different temperature stages.

LV T, LI Y, GONG Y, LI M, ZHAO H

Method for improving heat dissipation of LED, involves respectively utilizing graphene and its derivative graphene oxide as external dopants to increase thermal conductivity of epoxy resin composite material and improves heat dissipation of epoxy resin encapsulated LED.

LI J, YI X, CUI K, DING H, XIE H

Ultra-high isotropic heat-conducting material comprises epoxy resin, two-dimensional sheet-metal nanofiller two-dimensional flake-carbon-based-thermally conductive filler, and thinner.

YANG S, WANG X, WANG Q, BAI S

Preparing flame-retardant epoxy resin composite material with simultaneous microwave peeling and intercalation of organically modified nano two-dimensional materials comprises mixing two-dimensional material and deionized water.

WU Z, DU J, GUO J, FAN Q