国家/地区 中国（8）
IPC部 C（8）
IPC大类 C08（8） C09（8） B29（2）
C01（2） H01（2） H05（2）
IPC小类 C08L（8）
IPC C09K005/14（8）
发明人 MA J（2）
公开年 2016（4） 2015（3）
申请年 2015（8）
专利权人 NINGBO INST .（2）

Heat conducting filling material comprises base, composite film of graphene/carbon nanotube composite material, and ceramic powder.

LIU Y, YANG J, QU Y

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

Low viscosity, high thermal conductivity, thermal insulating plastic comprises polymer resin, inorganic powder, graphene/carbon nano tube multi-arm guide hot filler, coupling agent, lubricant and antioxidant.

CHEN M, LEI C, XU R, YANG Y, ZHANG X, XIE J, XU L

Graphene product used for LED casing and fluorescent screen comprises graphene, melamine, formaldehyde, paper pulp and mold release agent.

JIAN S

Graphene-based heat conduction silica gel phase change composite material comprises silicon substrate, and heat conduction phase change material, which is dispersed in silicon substrate and contains heat conductive filler.

DING S, LIU Z, ZHOU X, MA J

Composite heat dissipating material, comprises graphene, silicon dioxide, alpha alumina, carbon nanotube, polypropylene, polysulfone resin, nylon and glass fiber.

DAI X

Graphite-based carbon material used as graphene precursor for preparing graphene dispersion, comprises rhombohedral graphite layer and hexagonal graphite layer, and has specified rate calculated based on X-ray diffraction method.

HASEGAWA S, KAMIYA N, HASEGAWA SHOJI, KAMIYA NAGISA, SHOJI H, NAGISA K, SHEN Y

Organic-inorganic composite thermally conductive filler used for e.g. thermally conductive thermoplastic resin comprises graphene oxide, hyperbranched polymer, coupling agent, and phenolic resin-coated thermally conductive inorganic filler.

CAO H, YUE L, YAN Y